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DATA SHEET
MOS INTEGRATED CIRCUIT
PD23C32000A
32M-BIT MASK-PROGRAMMABLE ROM 4M-WORD BY 8-BIT (BYTE MODE)/2M-WORD BY 16-BIT (WORD MODE)
Description
The PD23C32000A is a 33,554,432 bits mask-programmable ROM. The word organization is selectable (BYTE mode: 4,194,304 words by 8 bits, WORD mode: 2,097,152 words by 16 bits). The active levels of OE (Output Enable Input) can be selected with mask-option. The PD23C32000A is packed in 44-pin plastic SOP, 48-pin plastic TSOP (I), and 44-pin plastic TSOP (II).
Features
* Word organization 4,194,304 words by 8 bits (BYTE mode) 2,097,152 words by 16 bits (WORD mode) * Access time 120 ns (MAX.) * Low current consumption Active ********** 70 mA (MAX.) Standby ******* 100 A (MAX.) (CMOS level input)
Ordering Information
Part Number Package 44-pin Plastic SOP (600 mil) 48-pin Plastic TSOP (I) (12 x 18 mm) (Normal bent) 48-pin Plastic TSOP (I) (12 x 18 mm) (Reverse bent) 44-pin Plastic TSOP (II) (400 mil) (Normal bent)
PD23C32000AGX-xxx PD23C32000AGY-xxx-MJH PD23C32000AGY-xxx-MKH PD23C32000AG5-xxx-7JFNote
(xxx: ROM code suffix No.) Note Under development
The information in this document is subject to change without notice. Document No. M12072EJ2V0DS00 (2nd edition) Date Published November 1997 N Printed in Japan
The mark
shows major revised points.
(c)
1996
PD23C32000A
Pin Configuration (Marking Side)
44-pin Plastic SOP (600 mil) [PD23C32000AGX]
NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE/OE/DC O0 O8 O1 O9 O2 O10 O3 O11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 WORD/BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC
A0 - A20 O15/A-1 WORD/BYTE CE OE/OE VCC GND NCNote 1 ICNote 2 DC
: : : : : : : : : :
Address inputs Data outputs Data 15 ouput (WORD mode)/LSB address input (BYTE mode) Mode select Chip enable Output enable Supply voltage Ground No connection Internal connection Don't care
O0 - 07, O8 - O14 :
Notes 1. Some signals can be applied because this pin is not connected to the inside of the chip. 2. Leave this pin unconnected or connect to GND.
2
PD23C32000A
48-pin Plastic TSOP (I) (12 x 18 mm) (Normal bent) [PD23C32000AGY-MJH]
WORD/BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 IC A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC IC O11 O3 O10 O2 O9 O1 O8 O0 OE/OE/DC GND GND
48-pin Plastic TSOP (I) (12 x 18 mm) (Reverse bent) [PD23C32000AGY-MKH]
GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC IC O11 O3 O10 O2 O9 O1 O8 O0 OE/OE/DC GND GND
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
WORD/BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 IC A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE
3
PD23C32000A
44-pin Plastic TSOP (II) (400 mil) (Normal bent) [PD23C32000AG5-7JF]
NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE/OE/DC O0 O8 O1 O9 O2 O10 O3 O11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 WORD/BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC
4
PD23C32000A
Input/Output Pin Functions
Input/ Output Input
Pin name WORD/BYTE
Function The pin for switching word mode and byte mode. High level ************ Word mode (2M-word by 16 bits) Low level ************ Byte mode (4M-word by 8 bits)
A0 to A20 (Address input)
Address bus. A0 to A20 are used differently in the word mode (2M-word by 16 bits) and the byte mode (4M-word by 8 bits). Word mode ********* A0 to A20 are used as 21 bits address signals. Byte mode ********** A0 to A20 are used as the upper 21 bits of total 22 bits of address signal. (The least significant bit (A-1) is combined to O15.)
O0 to O7, O8 to O14 (Data output)
Output
Output data bus. O0 to O7, O8 to O14 are used differently in the word (2M-word by 16 bits) and the byte mode (4M-word by 8 bits). Word mode ********* The lower 15 bits of 16 bits data outputs to O0 to O14. (The most significant bit (O15) combined to A-1.) Byte mode ********** 8 bits data outputs to O0 to O7 and also O8 to O14 is high impedance.
O15/A-1 (Data output 15)/ (LSB Address input)
Output/ Input
O15/A-1 are used differently in the word (2M-word by 16 bits) and the byte mode (4M-word by 8 bits). Word mode ********* The most significant output data bus (O15). Byte mode ********** The least significant address bus (A-1).
CE (Chip Enable)
Input
Chip activating signal. When the OE is active, output states are following. High level ************ High impedance Low level ************ Data out
OE/OE/DC (Output Enable/Don't care) VCC GND NC IC -- -- -- --
Output enable signal. The active level of OE is mask option. The active level of OE can be selected from high active, low active and Don't care at order. Supply voltage Ground Not internally connected. (The signal can be connected.) Internally connected. (Leave this pin unconnected or connect to GND.)
5
PD23C32000A
Block Diagram
O8 O0 O1 O9 O10 O2 O11 O3 O12 O4 O13 O5 O14 O6 O15/A-1 O7
A0 A1 A2 A3 A4 A5 A6 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20
Address Input Buffer Y-Decoder
Output Buffer
Logic/Input
WORD/BYTE OE/OE/DC
Y-Selector
A7
Memory Cell Matrix
X-Decoder Input Buffer
2,097,152 by 16 bits/4,194,304 by 8 bits
CE
6
PD23C32000A
Mask Option
The active levels of output enable pin (OE/OE/DC) are mask programmable and optional, and can be selected from among "0" "1" "x" shown in the table below.
Option 0 1 x OE/OE/DC OE OE DC OE active level L H Don't care
Operation modes for each option are shown in the tables below. Operation mode (Option: 0)
CE L H H H or L Standby OE L Active High impedance High impedance Mode Output state Data out
Operation mode (Option: 1)
CE L H H H or L Standby OE L Active Data out High impedance Mode Output state High impedance
Operation mode (Option: x)
CE L H DC H or L H or L Mode Active Standby Output state Data out High impedance
Remark L : H:
Low level input High level input
7
PD23C32000A
Electrical Specifications
Absolute Maximum Ratings
Parameter Supply voltage Input voltage Output voltage Operating ambient temperature Storage temperature Symbol VCC VI VO TA Tstg Conditions Ratings -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to VCC +0.3 -10 to +70 -65 to +150 Unit V V V C C
Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational sections of this specification. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Capacitance (TA = 25 C)
Parameter Input capacitance Output capacitance Symbol CI CO Test conditions f = 1 MHz MIN. TYP. MAX. 10 12 Unit pF pF
DC Characteristics (TA = -10 to +70 C, VCC = 5.0 V 10 %)
Parameter High level input voltage Low level input voltage High level output voltage Symbol VIH VIL VOH1 VOH2 Low level output voltage Input leakage current Output leakage current Power supply current Standby current VOL ILI ILO ICC1 ICC2 ICC3 IOH = -400 A IOH = -100 A IOL = 2.1 mA VI = 0 to VCC VO = 0 to VCC, Chip deselected CE = VIL (Active mode), IO = 0 mA CE = VIH (Standby mode) CE = VCC -0.2 V (Standby mode) -10 -10 Test conditions MIN. 2.2 -0.3 2.4 VCC -0.5 0.4 +10 +10 70 1.5 100 V TYP. MAX. VCC +0.3 +0.8 Unit V V V
A A
mA mA
A
8
PD23C32000A
AC Characteristics (TA = -10 to +70 C, VCC = 5.0 V 10 %)
Parameter Address access time Chip enable access time Output enable access time Output hold time Output disable time WORD/BYTE access time Symbol tACC tCE tOE tOH tDF tWB 0 0 25 120 Test conditions MIN. TYP. MAX. 120 120 50 Unit ns ns ns ns ns ns
Remark tDF is the time from inactivation of CE or OE/OE to high-impedance state output. AC Test Conditions Input waveform (Rise/Fall time 5 ns)
2.0 V Test points 0.8 V
2.0 V 0.8 V
Output waveform
2.0 V Test points 0.8 V
2.0 V 0.8 V
Output load 1TTL + 100 pF
9
PD23C32000A
Read Cycle Timing Chart
A0 to A20, A-1Note 1
(Input)
tACC
CE
(Input)
tCE
tDFNote 2
OE/OE
(Input)
tOE O0 to O7,Note 3 (Output) O8 to O15 High impedance
tOH
Data Out
Notes 1. 2. 3.
During WORD mode, A-1 is O15. tDF is specified when the one of CE, OE or OE is inactivated. During BYTE mode, O8 to O14 are high impedance and O15 is A-1.
WORD/BYTE Switch Timing Chart
A-1
(Input)
High impedance
High impedance
WORD/BYTE (Input)
tOH
tACC
tOH
tWB
O0 to O7
(Output)
Data Out
Data Out
Data Out
tDF High impedance
O8 to O15
(Output)
Data Out
Data Out
Remark OE/OE, CE: Active.
10
PD23C32000A
Notice of change in 48-pin TSOP (I) standoff height We are changing the 48-pin TSOP (I) standoff height 0.05 0.05 mm (low standoff height) to 0.1 0.05 mm (high standoff height). Each lot version is identified by the fifth character of the lot number. Difference between high standoff height and low standoff height Detail of lead end
Normal bent
Reverse bent
Q Q
High standoff height: Q = 0.1 0.05 mm Low standoff height: Q = 0.05 0.05 mm
Identification of each lot version Each lot version is identified by the fifth character of the lot number.
Fifth character of the lot number L K Lot version L version K version Standoff height 0.1 0.05 mm (High standoff height) 0.05 0.05 mm (Low standoff height)
Marking Example
JAPAN
D23Cxxxxx
XXXX
XXXX
Lot number
11
PD23C32000A
Package Drawings
44 PIN PLASTIC SOP (600 mil)
44 23
detail of lead end
P 1 A F G 22 H I J
S
E C D M
M
N
S
B K
L
NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
ITEM A B C D E F G H I J K L M N P
MILLIMETERS 27.83 +0.4 -0.05 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.150.1 3.0 MAX. 2.70.05 16.040.3 13.240.1 1.40.2 0.22 +0.08 -0.07 0.80.2 0.12 0.10 3 +7 -3
INCHES 1.096 +0.016 -0.003 0.031 MAX. 0.050 (T.P.) 0.017 +0.003 -0.004 0.0060.004 0.119 MAX. 0.106 +0.003 -0.002 0.631 +0.013 -0.012 0.521 +0.005 -0.004 0.0550.008 0.009 +0.003 -0.004 0.031 +0.009 -0.008 0.005 0.004 3 +7 -3 P44GX-50-600A-3
12
PD23C32000A
L Version: High standoff height
48 PIN PLASTIC TSOP (I) (12x18)
1 48 F G R detail of lead end
Q 24 25 E P I J A
L S
S K
NOTES 1. Controlling dimension Millimeter.
C
B
N
S
D
MM
ITEM A B C MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.220.05 0.10.05 1.2 MAX. 1.00.05 16.40.1 0.80.2 0.1450.05 0.5 0.10 0.10 18.00.2 3 +5 -3 0.25 0.600.15 INCHES 0.472 +0.005 -0.004 0.018 MAX. 0.020 (T.P.) 0.009 +0.002 -0.003 0.0040.002 0.048 MAX. 0.039 +0.003 -0.002 +0.004 0.646 -0.005 0.031 +0.009 -0.008 0.006 +0.002 -0.003 0.020 0.004 0.004 +0.008 0.709 -0.009 3 +5 -3 0.010 +0.006 0.024 -0.007 S48GY-50-MJH1
2. Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 3. "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX. <0.489 inch MAX.>)
D E F G I J K L M N P Q R S
13
PD23C32000A
L Version: High standoff height
48 PIN PLASTIC TSOP (I) (12x18)
1 48 E Q detail of lead end S L
R G F K N S S D MM C B
24
25
I P
NOTES 1. Controlling dimension Millimeter.
J
A
ITEM A B C
MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.220.05 0.10.05 1.2 MAX. 1.00.05 16.40.1 0.80.2 0.1450.05 0.5 0.10 0.10 18.00.2 3 +5 -3 0.25 0.600.15
INCHES 0.472 +0.005 -0.004 0.018 MAX. 0.020 (T.P.) 0.009 +0.002 -0.003 0.0040.002 0.048 MAX. 0.039 +0.003 -0.002 +0.004 0.646 -0.005 0.031 +0.009 -0.008 0.006 +0.002 -0.003 0.020 0.004 0.004 +0.008 0.709 -0.009 3 +5 -3 0.010 +0.006 0.024 -0.007 S48GY-50-MKH1
2. Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 3. "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX. <0.489 inch MAX.>)
D E F G I J K L M N P Q R S
14
PD23C32000A
K Version: Low standoff height
48 PIN PLASTIC TSOP (I) (12x18)
1
48 S
detail of lead end
Q 24 25
R
P I J A G
H L N K S
S D M
C B
M
NOTES 1. Controlling dimension millimeter.
ITEM A B C D G H I J K L M N P Q R S
MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.22 +0.08 -0.07 0.97 17.00.2 16.40.1 0.80.2 0.145 +0.03 -0.055 0.50.1 0.08 0.10 18.00.2 0.050.05 2 +4 -2 1.020.08
INCHES 0.472 +0.005 -0.004 0.018 MAX. 0.020 (T.P.) 0.009 +0.003 -0.004 0.038 0.669 +0.009 -0.008 0.646 +0.004 -0.005 0.031 +0.009 -0.008 0.006+0.001 -0.003 0.020 +0.004 -0.005 0.003 0.004 0.709 +0.008 -0.009 0.0020.002 2 +4 -2 0.040+0.004 -0.003 S48GY-50-MJH-3
2. Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition. 3. "A" excIudes mold flash. (Includes mold flash : 12.4 mm MAX. < 0.489 inch MAX.>)
15
PD23C32000A
K Version: Low standoff height
48 PIN PLASTIC TSOP (I) (12x18)
1
48 detail of lead end
Q
R
24
25
S
K H
N
S L
D
M C
M
B
S I P J A G
NOTES 1. Controlling dimension millimeter.
ITEM A B C D G H I J K L M N P Q R S
MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.22 +0.08 -0.07 0.97 17.00.2 16.40.1 0.80.2 0.145 +0.03 -0.055 0.50.1 0.08 0.10 18.00.2 0.050.05 2+4 -2 1.020.08
INCHES 0.472 +0.005 -0.004 0.018 MAX. 0.020 (T.P.) 0.009 +0.003 -0.004 0.038 0.669 +0.009 -0.008 0.646 +0.004 -0.005 0.031 +0.009 -0.008 0.006 +0.001 -0.003 0.020 +0.004 -0.005 0.003 0.004 0.709 +0.008 -0.009 0.0020.002 2+4 -2 0.040+0.004 -0.003 S48GY-50-MKH-3
2. Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.
3. "A" excIudes mold flash. (Includes mold flash : 12.4 mm MAX. < 0.489 inch MAX.>)
16
PD23C32000A
44 PIN PLASTIC TSOP(II) (400 mil)
44
23
detail of lead end
F E
1 A
22
H I
G K
P
J
C D M
M
N
B
L
NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
ITEM A B C D E F G H I J K L M N P
MILLIMETERS 18.63 MAX. 0.93 MAX. 0.8 (T.P.) 0.32 +0.08 -0.07 0.10.05 1.2 MAX. 0.97 11.760.2 10.160.1 0.80.2 0.145 +0.025 -0.015 0.50.1 0.13 0.10 3 +7 -3
INCHES 0.734 MAX. 0.037 MAX. 0.031 (T.P.) 0.0130.003 0.0040.002 0.048 MAX. 0.038 0.4630.008 0.4000.004 0.031 +0.009 -0.008 0.0060.001 0.020 +0.004 -0.005 0.005 0.004 3 +7 -3 S44G5-80-7JF5
17
PD23C32000A
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the PD23C32000A. Types of Surface Mount Device
PD23C32000AGX
: 44-pin Plastic SOP (600 mil)
PD23C32000AGY-MJH : 48-pin Plastic TSOP (I) (12 x 18 mm) (Normal bent) PD23C32000AGY-MKH: 48-pin Plastic TSOP (I) (12 x 18 mm) (Reverse bent) PD23C32000AG5-7JF : 44-pin Plastic TSOP (II) (400 mil) (Normal bent)
18
PD23C32000A
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
19
PD23C32000A
[MEMO]
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited without governmental license, the need for which must be judged by the customer. The export or re-export of this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96.5
20

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